<IC>可靠度後續問題

Kaka

請問各位是否有過經驗,經過壓力鍋或是恆溫恆濕之後的測試樣品會變得髒髒的,像是QFN的lead(端子) 或是 BGA產品的錫球,變得太髒導致之後的電測都測試不到,不知道能分享之後如何把樣品清理乾淨的經驗嗎?  非常感謝~

amy

感謝分享，謝謝您~

hlperng

主動零件在高性能能應用 (high performance applications)，對於作業環境潔淨度要求嚴格，常要求在無塵室中工作，局部正壓作業區域，使用吸塵與集塵措施，盡量少用會釋放或沾附污染物容器運具材料等，就是為了預防在完成組裝之前，特別有密封設計，在裝置成品內部含有污染物質。
同樣，上項靜電放電敏感零件，在組裝作業應用時，也要注意靜電放電防護的議題。

試驗後清潔可參考 JEDEC 22-A102,
5.2 Readout
...
Condensed moisture on the exterior surface of the device package may be removed through contact with an abosrbing medium or isopropyl alcohol.  Because the purpose of this test is to identify failure mechanisms internal to the package, cleaning of he packaged device or leads is permitted, providing it doesn't induce anomalous failures or obscure valid failures.  

5.3 Handling
Hand-covering which eliminate any source of ancillary contamination or ESD damage shall be used to handle devices and test fixtures.  Contamination control is important in the application of this test method and any highly-accelerated moisture stress test.