IEEE-STD-1156.2：電腦系統環境規格

hlperng

IEEE-STD-1156.2-1996 (R2003) (Stabilized 2009), IEEE Standard for Environmental Specifications for Computer Systems(電腦系統環境規格)

目錄

1. 概述 (Overview)
2. 參考文獻 (References)
3. 名詞 (Terminonlogy)
4. 性能層級鑑定 (Performance Level Qualification)
5. 共同測試條件 (Common Testing Conditions)
6. 不操作環境核心條件 (Nonoperating Environmental Core Conditions)
    6.1 低溫，不操作/儲存 (Low Temperature (nonoperating/storage))
    6.2 高溫，不操作/儲存 (High Temperature (nonoperating/storage))
    6.3 溫度衝擊，不操作/儲存 (Thermal Shock (nonoperating/storage))
    6.4 濕度，不操作/儲存 (Humidity (nonoperating/storage))
    6.5 自由跌落，不操作/儲存 (Free Fall (nonoperating/storage))
    6.6 振動，不操作/儲存 (Vibration (nonoperating/storage))
    6.7 衝擊，不操作/儲存 (Shock (nonoperating/storage))
    6.8 混合流動氣體，不操作/儲存 (Mixed Flowing Gas Corrosion (nonoperating/storage))
    6.9 霉菌，不操作/儲存 (Fungus (nonoperating/storage))
    6.10 可燃性，不操作/儲存 (Flammability (nonoperating/storage))
    6.11 靜電放電，不操作/儲存 (Electrostatic Discharge (ESD) (nonoperating/storage))
7. 操作環境條件 (Operating Environmnetal Conditions)
    7.1 低溫，操作(Low Temperature (operating))
    7.2 高溫，操作 (High Temperature (operating))
    7.3 正弦振動，操作 (Sinusoidal Vibration (operating))
    7.4 衝擊，操作 (Shock (operating))
    7.5 低氣壓，操作 (Low Air Presure (operating))
    7.6 靜電放電，操作 (Electrostatic Discharge (ESD) (operating))
    7.7 電磁干擾，操作 (Electromagnetic Interference (EMI) (operating))
    7.8 地震保護 (Earthquake Protection)

附錄A (參考)：強迫對流冷卻模組熱試驗 (Annex A (informative) Thermal Testing of Forced Convection-cooled Modules)
附錄B (參考)：衝擊與振動夾具 (Annex B (informative) Shock and Vibration Fixture)

hlperng

表 1 及表 2：

試驗參數	試驗文件	嚴厲度或條件	PL1要求	PL2要求
6.1 儲存低溫	IEC 60068-2-1, Test Ab	24 h	-40 °C	-40 °C
7.1 操作低溫	IEC 60068-2-1, Test Ad	4 h	+5 °C	+10 °C
6.2 儲存高溫	IEC 60068-2-2, Test Bb	24 h	+65 °C	+55 °C
7.2 操作高溫	IEC 60068-2-2, Test Bd	4 h	+50 °C / 75 h	+ 35 °C
6.3 不操作熱衝擊	IEC 60068-2-14, Test Na	< 5 min	-40 °C 至 +65 °C	----
6.4 濕度	IEC 60068-2-30, Test Dd	6 cycles	25 - 55 °C 92 ± 3 %RH	25 - 55 °C 92 ± 3 %RH
7.5 操作低壓	IEC 60068-2-13	6 h	10.5 - 5.5 Pa	10.5 - 7.85 Pa
6.5.1 包裝自由落下	IEC 60068-2-32	角與面	參考另表	參閱本文
6.5.2 無包準搬運	IEC 60068-2-32	角與面
6.6 不操作振動	IEC 60068-2-6, Test Fc	5 Hz - 200 Hz/300 Hz
7.3 操作正弦振動
6.7 不操作衝擊
7.4 操作衝擊
6.8 儲存霉菌
6.10 耐燃性
6.11 不操作靜電放電
7.6 操作靜電放電
7.7 操作電磁干擾

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1156.2-1996 - IEEE Standard for Environmental Specifications for Computer Systems