IEEE-STD-1156.1-1993 (2009) 電腦模組微電子計算器環境規格

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IEEE-STD-1156.1-1993 (Stabilized 2009), IEEE Standard Microcomputer Environmental Specification for Computer Modules (電腦模組微電子計算器環境規格)

目錄

1. Overview (概述)
2. Scope (範圍)
3. Purpose (目的)
4. References (參考文獻)
5. Terminology (名詞)
6. Nonoperating Environmental Conditions (不操作環境條件)
    6.1 Low Temperature (nonoperating/storage) (低問，不操作/儲存)
    6.2 High Temperature (nonoperating/storage) (高溫，不操作/儲存)
    6.3 Thermal Shock (nonoperating/storage) (熱衝擊，不操作/儲存)
    6.4 Humidity (nonoperating/storage) (濕度，不操作/儲存)
    6.5 Shock (nonoperating/storage) (衝擊，不操作/儲存)
    6.6 Salt Fog Corrosion (nonoperating/storage) (鹽霧腐蝕，不操作/儲存)
    6.7 Mixed Flowing Gas Corrosion (nonoperating/storage) (混合流動氣體腐蝕，不操作/儲存)
    6.8 Fungus (nonoperating/storage) (霉菌，不操作/儲存)
    6.9 Flammability (可燃性)
    6.10 Electrostatic Discharge (ESD) (nonoperating/storage) (靜電放電，不操作/儲存)
7. Operating Environmental Conditions (操作環境條件)
    7.1 Low Temperature (operating) (低溫，操作)
    7.2 High Temperature (operating) (高溫，操作)
    7.3 Sinusoidal Vibration (operating) (正弦振動，操作)
    7.4 Random Vibration (operating) (隨機振動，操作)
    7.5 Shock (operating) (衝擊，操作)
    7.6 Low Air Pressure (operating) (低氣壓，操作)
    7.7 Electrostatic Discharge (ESD) (operating) (靜電放電，操作)
    7.8 Electromagnetic Interference (EMI) (operating) (電磁干擾，操作)
    7.9 Life Test (operating) (壽命試驗，操作)
8. Test Sequence (試驗次序)
    8.1 Testing after Failure (失效後測試)
    8.2 Module Changes (模組變更)
    8.3 Test Groups (試驗分組)
Anneses
    Annex A (informative) Shock and Vibration Fixtures (附錄A：衝擊與振動夾具)
    Annex B (informative) Thermal Testing of Forced Convection-cooled Modules (附錄B：強迫對流冷卻模組熱試驗)