試驗後清潔可參考 JEDEC 22-A102,
5.2 Readout
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Condensed moisture on the exterior surface of the device package may be removed through contact with an abosrbing medium or isopropyl alcohol. Because the purpose of this test is to identify failure mechanisms internal to the package, cleaning of he packaged device or leads is permitted, providing it doesn't induce anomalous failures or obscure valid failures.
5.3 Handling
Hand-covering which eliminate any source of ancillary contamination or ESD damage shall be used to handle devices and test fixtures. Contamination control is important in the application of this test method and any highly-accelerated moisture stress test.